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| Parameter | Details |
|---|---|
| Product Name | Polishing Lubricants GHX-CON-POL-LUB-001 |
| Brand | G-Hexa |
| Form | Liquid |
| Function | Polishing Lubricant / Performance Enhancer |
| Application Compatibility | Diamond Suspensions, Compounds, Sprays, Films |
| Usage Method | Manual Application or Automatic Dispenser |
| Key Benefit | Reduces Friction, Extends Polishing Cloth Life |
| Packaging Options | 500 ml, 1000 ml |
| Order Numbers | 06.09.510 (500 ml), 06.09.520 (1000 ml) |
| Parameter | Details |
|---|---|
| Product Name | Water-free Blue Low-viscosity Polishing Lubricant GHX-CON-POL-LUB-002 |
| Brand | G-Hexa |
| Form | Liquid |
| Base Type | Alcohol-Soluble (Water-Free) |
| Color | Blue |
| Viscosity | Low Viscosity |
| Application Compatibility | Water-Sensitive Materials, Coarse/Fine/Ultra-Fine Polishing |
| Key Function | Reduces Friction, Protects Polishing Cloth, Enhances Cleaning |
| Packaging Options | 500 ml, 1000 ml, 5000 ml |
| Order Numbers | 06.09.640 (500 ml), 06.09.650 (1000 ml), 06.09.630 (5000 ml) |
| Parameter | Details |
|---|---|
| Product Name | Colloidal Silica GHX-CON-POL-SIL-004 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Material | Colloidal Silica (SiO₂) |
| Particle Size | 50 nm |
| Function | Chemical-Mechanical Polishing (CMP) |
| Application Scope | All Materials (Special focus on electronics and semiconductors) |
| Packaging Options | 500 ml, 1000 ml, 5000 ml |
| Order Numbers | 06.08.310 (500 ml), 06.08.311 (1000 ml), 06.08.312 (5000 ml) |
| Application Compatibility | PCBs, Electronic Components, Semiconductors, Metals, Advanced Materials |
| Finish Quality | Ultra-Fine, Mirror Finish (Final Polishing Stage) |
| Parameter | Details |
|---|---|
| Product Name | Crystallizing Silica GHX-CON-POL-SIL-003 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Material | Colloidal Silica (SiO₂) |
| Particle Size | 50 nm |
| pH Level | 10.2 (Alkaline) |
| Function | Chemical-Mechanical Polishing (CMP) |
| Formulation Type | Crystallizing Silica Suspension |
| Packaging Options | 500 ml, 1000 ml |
| Order Numbers | 06.07.520 (500 ml), 06.07.523 (1000 ml) |
| Application Compatibility | Tin, Aluminium, Aluminium-Magnesium Alloys, PCBs, ICs, Non-Ferrous Metals |
| Finish Quality | Ultra-Fine, Mirror Finish (Final Polishing Stage) |
| Parameter | Details |
|---|---|
| Product Name | Non-Crystallizing Silica GHX-CON-POL-SIL-002 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Material | Colloidal Silica (SiO₂) |
| Particle Size | 50 nm |
| pH Level | 10.2 (Alkaline) |
| Function | Chemical-Mechanical Polishing (CMP) |
| Crystallization | Non-Crystallizing Formulation |
| Packaging Options | 500 ml, 1000 ml, 1.9 L |
| Order Numbers | 06.07.310 (500 ml), 06.07.320 (1000 ml), 06.07.322 (1.9 L) |
| Application Compatibility | Non-Ferrous Metals, Aluminium, PCBs, ICs, Electronics |
| Finish Quality | Ultra-Fine, Mirror Finish (Final Polishing Stage) |
| Parameter | Details |
|---|---|
| Product Name | Non-Crystallizing Silica GHX-CON-POL-SIL-001 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Material | Colloidal Silica (SiO₂) |
| Particle Size | 50 nm |
| pH Level | 10.5 (Alkaline) |
| Function | Chemical-Mechanical Polishing (CMP) |
| Crystallization | Non-Crystallizing Formulation |
| Packaging Options | 500 ml, 1000 ml, 5000 ml |
| Order Numbers | 06.05.310 (500 ml), 06.05.320 (1000 ml), 06.05.330 (5000 ml) |
| Application Compatibility | Titanium, Stainless Steel, Metals, Alloys |
| Finish Quality | Ultra-Fine, Mirror Finish (Final Polishing Stage) |
| Parameter | Details |
|---|---|
| Product Name | Polycrystalline Diamond Paste GHX-CON-POL-DIA-005 |
| Brand | G-Hexa |
| Form | Paste |
| Base Type | Water-Based |
| Abrasive Material | Polycrystalline Diamond |
| Particle Sizes Available | 1 μm, 3 μm, 6 μm, 9 μm |
| Color Coding | Black (All Sizes) |
| Packaging | 10 g |
| Order Numbers | 06.10.110 (1 μm), 06.10.130 (3 μm), 06.10.160 (6 μm), 06.10.190 (9 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Performance | High Polishing Speed with Enhanced Surface Finish |
| Parameter | Details |
|---|---|
| Product Name | SP-D Monocrystalline Diamond Spray GHX-CON-POL-DIA-004 |
| Brand | G-Hexa |
| Form | Spray |
| Base Type | Water-Based |
| Abrasive Material | Monocrystalline Diamond |
| Particle Sizes Available | 0.5 μm, 1 μm, 2.5 μm, 3.5 μm, 5 μm, 10 μm |
| Application Method | Direct Spray Application |
| Packaging | 350 ml |
| Order Numbers | 06.03.115 (0.5 μm), 06.03.320 (1 μm), 06.03.325 (2.5 μm), 06.03.330 (3.5 μm), 06.03.335 (5 μm), 06.03.340 (10 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Performance | High Polishing Efficiency with Uniform Coverage |
| Parameter | Details |
|---|---|
| Product Name | Monocrystalline Diamond Paste GHX-CON-POL-DIA-003 |
| Brand | G-Hexa |
| Form | Paste |
| Base Type | Water-Based |
| Abrasive Material | Monocrystalline Diamond |
| Particle Sizes Available | 1 μm, 3 μm, 6 μm, 9 μm |
| Color Coding | 1 μm (Blue), 3 μm (Green), 6 μm (Yellow), 9 μm (Red) |
| Packaging | 5 g |
| Order Numbers | 06.10.030 (1 μm/Blue), 06.10.040 (3 μm/Green), 06.10.050 (6 μm/Yellow), 06.10.060 (9 μm/Red) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Performance | High Polishing Speed with Excellent Surface Finish |
| Parameter | Details |
|---|---|
| Product Name | PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Base Type | Water-Based |
| Abrasive Material | Polycrystalline Diamond |
| Particle Sizes Available | 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm |
| Dispersion Type | Stable, Uniform Suspension |
| Packaging | 500 ml |
| Order Numbers | 06.02.210 (0.25 μm), 06.02.220 (0.5 μm), 06.02.230 (1 μm), 06.02.240 (3 μm), 06.02.250 (6 μm), 06.02.260 (9 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Performance | Faster Polishing Rate with Enhanced Surface Finish |
| Parameter | Details |
|---|---|
| Product Name | MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Base Type | Water-Based |
| Abrasive Material | Monocrystalline Diamond |
| Particle Sizes Available | 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm |
| Dispersion Type | Stable, Uniform Suspension |
| Packaging | 500 ml |
| Order Numbers | 06.01.110 (0.25 μm), 06.01.120 (0.5 μm), 06.01.130 (1 μm), 06.01.140 (3 μm), 06.01.150 (6 μm), 06.01.160 (9 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Finish Quality | Coarse to Ultra-Fine Polishing Capability |
| Parameter | Details |
|---|---|
| Product Name | AO-P De-agglomerated Alumina Polishing Powder GHX-CON-POL-ALU-004 |
| Brand | G-Hexa |
| Form | Powder |
| Material | High-Purity Alumina (Al₂O₃) |
| Particle Type | De-agglomerated |
| Particle Sizes Available | 0.05 μm, 0.3 μm, 1 μm |
| Particle Distribution | Strict, Controlled Size Distribution |
| Packaging | 500 g |
| Order Numbers | 06.13.011 (0.05 μm), 06.13.021 (0.3 μm), 06.13.031 (1 μm) |
| Preparation Method | Mix with DI Water Before Use |
| Application Compatibility | Metals, Minerals, Ceramics, PCBs, Semiconductors |
| Finish Quality | Fine to Ultra-Fine Surface Finishing |
| Parameter | Details |
|---|---|
| Product Name | AO-W Alumina Suspension GHX-CON-POL-ALU-003 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Base Type | Water-Based |
| Material | High-Purity Alumina (Al₂O₃) |
| Particle Sizes Available | 0.05 μm, 0.3 μm, 1 μm |
| Dispersion Type | Stable, Uniform Suspension |
| Packaging | 500 ml |
| Order Numbers | 06.04.210 (0.05 μm), 06.04.220 (0.3 μm), 06.04.230 (1 μm) |
| Application Compatibility | Copper, Tin, Soft Metals, Plastics, PCBs, SMT, Semiconductors |
| Finish Quality | Fine to Ultra-Fine Surface Finishing |
| Parameter | Details |
|---|---|
| Product Name | Super Alumina Polishing Suspension GHX-CON-POL-ALU-002 |
| Brand | G-Hexa |
| Form | Gel Suspension |
| Material | High-Purity Alumina (Al₂O₃) |
| Particle Type | Non-Agglomerated |
| Particle Size | 0.05 μm |
| Dispersion Type | Stable, Uniform Gel-Based Dispersion |
| Packaging Options | 500 ml, 1.9 L |
| Order Numbers | 06.04.410 (500 ml), 06.04.414 (1.9 L) |
| Application Compatibility | Metals, Minerals, Carbides, Polymers, PCBs, Precious Metals |
| Finish Quality | Ultra-Fine, Mirror Finish Capability |
| Parameter | Details |
|---|---|
| Product Name | Super Alumina Polishing Powder |
| Brand | G-Hexa |
| Material | High-Purity Alumina (Al₂O₃) |
| Particle Type | Non-Agglomerated |
| Available Particle Sizes | 0.05 μm, 0.3 μm |
| Surface Finish Quality | Ultra-Fine, Mirror Finish Capability |
| Packaging | 1 LB |
| Order Numbers | 06.14.010 (0.05 μm), 06.14.020 (0.3 μm) |
| Application Compatibility | Metals, Minerals, PCBs, Semiconductors |
| Purity | High Purity, Low Contamination |
| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-011 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Magnetic Strength | High-performance neodymium magnets – firm hold for all conversion plates |
| Surface Flatness | < 0.01 mm (precision ground) |
| Material | High-grade steel core with corrosion-resistant coating |
| Attachment Method | Direct mount to grinder/polisher chassis (replaces standard platen) |
| Compatibility | All G-Hexa AD-PSA, AD-PB, AD-Foil conversion plates; standard magnetic platen systems |
| Thickness | Standard metallographic platen thickness (~10–12 mm) |
| Max Operating Speed | Up to 1200 rpm (balanced & vibration-free) |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Cleaning Method | Wipe with damp cloth or rinse with water |
| Order Numbers | 04.08.010 (200 mm), 04.08.020 (250 mm), 04.08.030 (300 mm) |
| Package | 1 pc |
| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-010 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Surface Type | Proprietary plain-back transfer layer |
| Consumable Compatibility | All plain-back (non-PSA) SiC papers, diamond grinding foils, diamond films, and similar non-adhesive abrasives |
| Mounting Method | Magnetic (if supported) or standard clamp to grinder platen |
| Material | Precision-machined aluminum alloy with durable transfer coating |
| Thickness | Standard metallographic platen thickness (~8–12 mm) |
| Reusability | Hundreds to thousands of cycles (water rinse to refresh) |
| Cleaning Method | Rinse with water only — no scraping or solvents required |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Order Numbers | 04.08.310 (200 mm), 04.08.320 (250 mm), 04.08.330 (300 mm) |
| Package | 1 pc |
| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-009 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Surface Type | Proprietary foil-optimized transfer layer |
| Adhesive Residue | None – clean water rinse removal |
| Compatible Consumables | All self-adhesive (PSA) foil-based SiC papers, diamond grinding foils, ultra-thin diamond films |
| Mounting Method | Magnetic (if supported) or standard clamp to grinder platen |
| Material | Precision-machined aluminum alloy with durable transfer coating |
| Thickness | Standard metallographic platen thickness (~8–12 mm) |
| Reusability | Hundreds to thousands of cycles (water rinse to refresh surface) |
| Cleaning Method | Rinse with water (no solvents or scraping required) |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Order Numbers | 04.08.422 (200 mm), 04.08.430 (250 mm), 04.08.432 (300 mm) |
| Package | 1 pc |
| Parameter | Specification |
|---|---|
| Model | GHX-GRP-CON-GRD-DIA-008 |
| Plate Diameter | 200 mm / 250 mm / 300 mm |
| Surface Type | Specialized high-performance PSA layer |
| Adhesive Residue | None – clean peel-off design |
| Compatibility | All PSA-backed abrasive discs, diamond films, polishing cloths |
| Mounting Method | Magnetic or direct clamp (depending on grinder model) |
| Material | Precision-machined aluminum alloy core with durable PSA coating |
| Thickness | Standard metallographic platen thickness (typically 8–12 mm) |
| Reusability | Hundreds to thousands of cycles (depending on usage & cleaning) |
| Cleaning Method | Wipe with IPA or mild solvent if needed; no scraping required |
| Operating Temperature | Up to 80 °C (wet grinding) |
| Order Numbers | 04.08.410 (200 mm), 04.08.413 (250 mm), 04.08.420 (300 mm) |
| Package | 1 pc |
| Micron Size | 8 inch (200 mm) Order No. | 10 inch (250 mm) Order No. | 12 inch (300 mm) Order No. | Package Quantity | Bond Type | Recommended Use Stage | Typical Surface Finish |
|---|---|---|---|---|---|---|---|
| 1 µm | 14.01.461-3 | 14.01.475-1 | 14.01.484-1 | 5 pcs | Resin | Final fine grinding / pre-polish | Near-mirror, Ra < 10 nm |
| 3 µm | 14.01.462-1 | 14.01.476-1 | 14.01.485-1 | 5 pcs | Resin | Fine grinding / intermediate polish | Very fine, low damage |
| 6 µm | 14.01.463-1 | 14.01.478-1 | 14.01.486-1 | 5 pcs | Resin | Medium-fine grinding | Smooth, controlled removal |
| 9 µm | 14.01.464-1 | 14.01.477-1 | 14.01.483-1 | 5 pcs | Resin | Medium grinding | Good flatness, minimal scratches |
| 15 µm | 14.01.465-1 | 14.01.479-1 | 14.01.487-1 | 5 pcs | Resin | Intermediate grinding | Fast stock removal, flat |
| 30 µm | 14.01.466-1 | 14.01.481-1 | 14.01.488-1 | 5 pcs | Resin | Rough grinding / plane preparation | Aggressive, uniform plane |
