PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002

Parameter Details
Product Name PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002
Brand G-Hexa
Form Liquid Suspension
Base Type Water-Based
Abrasive Material Polycrystalline Diamond
Particle Sizes Available 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm
Dispersion Type Stable, Uniform Suspension
Packaging 500 ml
Order Numbers 06.02.210 (0.25 μm), 06.02.220 (0.5 μm), 06.02.230 (1 μm), 06.02.240 (3 μm), 06.02.250 (6 μm), 06.02.260 (9 μm)
Application Compatibility Metals, Ceramics, Carbides, Semiconductors, Composites
Performance Faster Polishing Rate with Enhanced Surface Finish
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Description

G-Hexa PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002 is a high-efficiency, water-based diamond polishing suspension engineered for faster material removal and superior surface finish. Formulated with polycrystalline diamond particles, it provides multiple cutting edges per particle, resulting in improved polishing performance and reduced processing time. Ideal for precision applications, it ensures consistent, high-quality results across a wide range of materials.

Specifications

Parameter Details
Product Name PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002
Brand G-Hexa
Form Liquid Suspension
Base Type Water-Based
Abrasive Material Polycrystalline Diamond
Particle Sizes Available 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm
Dispersion Type Stable, Uniform Suspension
Packaging 500 ml
Order Numbers 06.02.210 (0.25 μm), 06.02.220 (0.5 μm), 06.02.230 (1 μm), 06.02.240 (3 μm), 06.02.250 (6 μm), 06.02.260 (9 μm)
Application Compatibility Metals, Ceramics, Carbides, Semiconductors, Composites
Performance Faster Polishing Rate with Enhanced Surface Finish

Key Applications & Uses

G-Hexa PD-WT Polycrystalline Diamond Suspension is ideal for high-efficiency polishing processes:

  • Rapid material removal in metallographic sample preparation
  • Precision polishing of hard materials such as ceramics and carbides
  • Surface finishing of metals including hardened alloys and tool steels
  • Semiconductor wafer polishing requiring fine surface control
  • Step-wise polishing from coarse to ultra-fine finishes
  • Preparation of advanced composites and engineered materials

Why Choose from G-Hexa?

G-Hexa provides advanced diamond polishing solutions optimized for performance and productivity:

  • Polycrystalline diamond structure offers multiple cutting edges for faster polishing
  • Improved surface finish compared to monocrystalline abrasives at the same grit
  • Water-based formulation ensures easy cleaning and system compatibility
  • Stable suspension for uniform application and consistent results
  • Wide particle size range supports complete polishing workflows
  • High purity composition minimizes contamination in sensitive applications

Frequently Asked Questions (FAQs)

Q1. What is the difference between polycrystalline and monocrystalline diamond suspensions?
Polycrystalline diamond particles have multiple cutting edges, enabling faster polishing and improved surface finish compared to monocrystalline particles.

Q2. What materials can this suspension be used on?
It is suitable for metals, ceramics, carbides, semiconductors, and composite materials.

Q3. Which particle size should I select?
Larger sizes (6–9 μm) are used for initial material removal, medium sizes (1–3 μm) for intermediate polishing, and finer sizes (0.25–0.5 μm) for final finishing.

Q4. Is this suspension ready to use?
Yes, it is supplied as a ready-to-use, stable suspension.

Q5. Does it provide faster polishing compared to other diamond suspensions?
Yes, the polycrystalline structure enables a higher polishing rate while maintaining excellent surface quality.

Q6. How should the product be stored?
Store in a cool, dry place in a tightly sealed container. Shake gently before use to maintain uniform dispersion.

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