PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002
| Parameter | Details |
|---|---|
| Product Name | PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Base Type | Water-Based |
| Abrasive Material | Polycrystalline Diamond |
| Particle Sizes Available | 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm |
| Dispersion Type | Stable, Uniform Suspension |
| Packaging | 500 ml |
| Order Numbers | 06.02.210 (0.25 μm), 06.02.220 (0.5 μm), 06.02.230 (1 μm), 06.02.240 (3 μm), 06.02.250 (6 μm), 06.02.260 (9 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Performance | Faster Polishing Rate with Enhanced Surface Finish |
Payment. Secure payments via Bank Transfer, UPI, Credit/Debit Card, and approved Institutional PO. Flexible terms available for bulk and research orders.
Quality Assurance. All products are quality-checked, performance-validated, and sourced from verified manufacturers to ensure reliability and compliance with laboratory standards.
Description
G-Hexa PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002 is a high-efficiency, water-based diamond polishing suspension engineered for faster material removal and superior surface finish. Formulated with polycrystalline diamond particles, it provides multiple cutting edges per particle, resulting in improved polishing performance and reduced processing time. Ideal for precision applications, it ensures consistent, high-quality results across a wide range of materials.
Specifications
| Parameter | Details |
|---|---|
| Product Name | PD-WT Polycrystalline Diamond Suspension GHX-CON-POL-DIA-002 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Base Type | Water-Based |
| Abrasive Material | Polycrystalline Diamond |
| Particle Sizes Available | 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm |
| Dispersion Type | Stable, Uniform Suspension |
| Packaging | 500 ml |
| Order Numbers | 06.02.210 (0.25 μm), 06.02.220 (0.5 μm), 06.02.230 (1 μm), 06.02.240 (3 μm), 06.02.250 (6 μm), 06.02.260 (9 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Performance | Faster Polishing Rate with Enhanced Surface Finish |







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