Colloidal Silica GHX-CON-POL-SIL-004

Parameter Details
Product Name Colloidal Silica GHX-CON-POL-SIL-004
Brand G-Hexa
Form Liquid Suspension
Material Colloidal Silica (SiOβ‚‚)
Particle Size 50 nm
Function Chemical-Mechanical Polishing (CMP)
Application Scope All Materials (Special focus on electronics and semiconductors)
Packaging Options 500 ml, 1000 ml, 5000 ml
Order Numbers 06.08.310 (500 ml), 06.08.311 (1000 ml), 06.08.312 (5000 ml)
Application Compatibility PCBs, Electronic Components, Semiconductors, Metals, Advanced Materials
Finish Quality Ultra-Fine, Mirror Finish (Final Polishing Stage)
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Description

G-Hexa Colloidal Silica GHX-CON-POL-SIL-004 is a high-purity, stable polishing suspension designed for precision final-stage surface finishing across a wide range of materials. Engineered with ultra-fine 50 nm colloidal silica particles, it delivers controlled chemical-mechanical polishing (CMP) action for achieving defect-free, mirror-quality surfaces. It is especially effective for printed circuit boards (PCBs), electronic components, and semiconductor materials, ensuring consistent and reliable performance in advanced laboratory and industrial applications.

Specifications

Parameter Details
Product Name Colloidal Silica GHX-CON-POL-SIL-004
Brand G-Hexa
Form Liquid Suspension
Material Colloidal Silica (SiOβ‚‚)
Particle Size 50 nm
Function Chemical-Mechanical Polishing (CMP)
Application Scope All Materials (Special focus on electronics and semiconductors)
Packaging Options 500 ml, 1000 ml, 5000 ml
Order Numbers 06.08.310 (500 ml), 06.08.311 (1000 ml), 06.08.312 (5000 ml)
Application Compatibility PCBs, Electronic Components, Semiconductors, Metals, Advanced Materials
Finish Quality Ultra-Fine, Mirror Finish (Final Polishing Stage)

Key Applications & Uses

G-Hexa Colloidal Silica GHX-CON-POL-SIL-004 is widely used in precision polishing workflows:

  • Final polishing of printed circuit boards (PCBs) for smooth, defect-free surfaces
  • Surface finishing of semiconductor materials for high-precision applications
  • Polishing of electronic components requiring ultra-fine surface quality
  • Chemical-mechanical polishing (CMP) for advanced material preparation
  • Removal of micro-scratches after mechanical or diamond polishing
  • Preparation of samples for microscopy and analytical characterization

Why Choose from G-Hexa?

G-Hexa provides advanced colloidal silica solutions designed for precision, consistency, and versatility:

  • Ultra-fine 50 nm particles ensure high-quality mirror finishes
  • Stable colloidal formulation delivers uniform polishing performance
  • Suitable for a wide range of materials, especially electronics and semiconductors
  • Optimized for final-stage polishing in high-precision applications
  • Available in multiple packaging sizes for laboratory and industrial needs
  • Reliable and repeatable results across research, production, and quality control environments

Frequently Asked Questions (FAQs)

Q1. What is colloidal silica used for?
Colloidal silica is used for final polishing to achieve ultra-smooth and mirror-like surfaces, especially in precision material preparation.

Q2. Which industries commonly use this product?
It is widely used in semiconductor manufacturing, electronics, PCB production, and metallography.

Q3. What does 50 nm particle size mean?
It refers to ultra-fine silica particles that enable extremely smooth surface finishing at the nanoscale level.

Q4. Is this suitable for all materials?
Yes, it is designed for broad material compatibility, with special effectiveness for electronics and semiconductor materials.

Q5. What is the main advantage of colloidal silica in polishing?
It provides a controlled chemical-mechanical polishing action that removes micro-scratches and enhances surface smoothness.

Q6. How should the product be stored?
Store in a cool, dry place in a sealed container. Shake gently before use to maintain uniform dispersion.

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