MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001

Parameter Details
Product Name MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001
Brand G-Hexa
Form Liquid Suspension
Base Type Water-Based
Abrasive Material Monocrystalline Diamond
Particle Sizes Available 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm
Dispersion Type Stable, Uniform Suspension
Packaging 500 ml
Order Numbers 06.01.110 (0.25 μm), 06.01.120 (0.5 μm), 06.01.130 (1 μm), 06.01.140 (3 μm), 06.01.150 (6 μm), 06.01.160 (9 μm)
Application Compatibility Metals, Ceramics, Carbides, Semiconductors, Composites
Finish Quality Coarse to Ultra-Fine Polishing Capability
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Description

G-Hexa MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001 is a high-performance, water-based diamond polishing suspension designed for precision finishing across a wide range of materials. Formulated with monocrystalline diamond particles, it ensures consistent cutting action, superior material removal, and excellent surface finish. Its stable dispersion and high purity make it ideal for metallography, semiconductor processing, and advanced material preparation.

Specifications

Parameter Details
Product Name MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001
Brand G-Hexa
Form Liquid Suspension
Base Type Water-Based
Abrasive Material Monocrystalline Diamond
Particle Sizes Available 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm
Dispersion Type Stable, Uniform Suspension
Packaging 500 ml
Order Numbers 06.01.110 (0.25 μm), 06.01.120 (0.5 μm), 06.01.130 (1 μm), 06.01.140 (3 μm), 06.01.150 (6 μm), 06.01.160 (9 μm)
Application Compatibility Metals, Ceramics, Carbides, Semiconductors, Composites
Finish Quality Coarse to Ultra-Fine Polishing Capability

Key Applications & Uses

G-Hexa MD-WT Monocrystalline Diamond Suspension is widely used for precision polishing applications:

  • Metallographic sample preparation for accurate microstructural analysis
  • Polishing of hard materials such as ceramics and carbides
  • Surface finishing of metals including hardened alloys and tool steels
  • Semiconductor wafer polishing requiring high precision and consistency
  • Step-wise polishing from coarse to fine finishes using different particle sizes
  • Preparation of advanced materials and composites for research and testing

Why Choose from G-Hexa?

G-Hexa delivers advanced diamond polishing solutions designed for performance and reliability:

  • Monocrystalline diamond particles provide consistent cutting and superior finish
  • Water-based formulation ensures easy cleaning and compatibility with most systems
  • Stable suspension prevents particle settling and ensures uniform application
  • Wide range of particle sizes supports complete polishing workflows
  • High purity formulation minimizes contamination in sensitive applications
  • Reliable and repeatable results across research, academic, and industrial environments

Frequently Asked Questions (FAQs)

Q1. What is the advantage of monocrystalline diamond abrasives?
Monocrystalline diamond particles provide consistent cutting edges, resulting in efficient material removal and high-quality surface finishes.

Q2. What materials can this suspension be used on?
It is suitable for a wide range of materials including metals, ceramics, carbides, semiconductors, and composites.

Q3. Which particle size should I use?
Larger sizes (6–9 μm) are used for initial polishing, medium sizes (1–3 μm) for intermediate steps, and finer sizes (0.25–0.5 μm) for final polishing.

Q4. Is this suspension ready to use?
Yes, it is supplied as a ready-to-use formulation with stable dispersion.

Q5. Does the suspension require shaking before use?
Gentle shaking is recommended to ensure uniform particle distribution before application.

Q6. How should the product be stored?
Store in a cool, dry place in a tightly sealed container to maintain stability and performance.

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