MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001
| Parameter | Details |
|---|---|
| Product Name | MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Base Type | Water-Based |
| Abrasive Material | Monocrystalline Diamond |
| Particle Sizes Available | 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm |
| Dispersion Type | Stable, Uniform Suspension |
| Packaging | 500 ml |
| Order Numbers | 06.01.110 (0.25 μm), 06.01.120 (0.5 μm), 06.01.130 (1 μm), 06.01.140 (3 μm), 06.01.150 (6 μm), 06.01.160 (9 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Finish Quality | Coarse to Ultra-Fine Polishing Capability |
Payment. Secure payments via Bank Transfer, UPI, Credit/Debit Card, and approved Institutional PO. Flexible terms available for bulk and research orders.
Quality Assurance. All products are quality-checked, performance-validated, and sourced from verified manufacturers to ensure reliability and compliance with laboratory standards.
Description
G-Hexa MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001 is a high-performance, water-based diamond polishing suspension designed for precision finishing across a wide range of materials. Formulated with monocrystalline diamond particles, it ensures consistent cutting action, superior material removal, and excellent surface finish. Its stable dispersion and high purity make it ideal for metallography, semiconductor processing, and advanced material preparation.
Specifications
| Parameter | Details |
|---|---|
| Product Name | MD-WT Monocrystalline Diamond Suspension GHX-CON-POL-DIA-001 |
| Brand | G-Hexa |
| Form | Liquid Suspension |
| Base Type | Water-Based |
| Abrasive Material | Monocrystalline Diamond |
| Particle Sizes Available | 0.25 μm, 0.5 μm, 1 μm, 3 μm, 6 μm, 9 μm |
| Dispersion Type | Stable, Uniform Suspension |
| Packaging | 500 ml |
| Order Numbers | 06.01.110 (0.25 μm), 06.01.120 (0.5 μm), 06.01.130 (1 μm), 06.01.140 (3 μm), 06.01.150 (6 μm), 06.01.160 (9 μm) |
| Application Compatibility | Metals, Ceramics, Carbides, Semiconductors, Composites |
| Finish Quality | Coarse to Ultra-Fine Polishing Capability |








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