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| Parameter | Details |
|---|---|
| Product Name | Lacey Carbon Films on 300 Mesh Copper Grids |
| Pack Size | 25 grids per grid box (custom packaging available as per requirement) |
| Grid Material | High-quality copper |
| Mesh Size | 300 mesh (standard square mesh) |
| Support Film Type | Lacey carbon (fine random mesh with high open area) |
| Film Characteristics | Thinnest possible support with adequate strength; minimal background interference in TEM |
| Open Area | Greater percentage than holey carbon films (ideal for unsupported specimen regions) |
| Compatibility | Standard 3.05 mm TEM grids; suitable for copper-based applications |
| Additional Options | Available on other grid sizes (e.g., 200, 400 mesh), materials (nickel, gold), or types on request |
| Grade | Research grade |
| Usage/Application | Transmission Electron Microscopy (TEM) specimen support |
| Availability | In stock; fast shipping for labs worldwide |
| Brand Equivalent Reference | Premium quality similar to Agar Scientific AGS166-3H series |
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| Parameter | Specification |
|---|---|
| Model | GHEXA-GRP-EQP-AUT-002 |
| Power Supply | AC 220V / 50 Hz + Ground; Total Power: 7 kW, Rated Power: 2 kW |
| Compressed Air | 0.6–0.7 MPa, Hose OD Φ10 mm |
| External Water Supply | <0.3 MPa, Pipe OD Φ10 mm |
| Drainage | Drain Pipe OD 32 mm |
| Sample Mounting Box Sizes | 39×47×12 mm / 30×27×12 mm; Max Quantity: 21 |
| Alignment System | 25 Megapixel CCD Camera; Field of View: 35×35 mm; Grinding Precision: ±10 μm |
| Laser Marking/Reading | Yes; Max Number of Lines: 30; Line Drawing: Specified distance translation |
| Grinding/Polishing Stations | 2 Stations; Disc Diameter: Φ254 mm; Rotation Speed: 100–1000 rpm; Motor: 1 kW |
| Grinding Head | Holds 3 Samples; Motor: 0.4 kW; Speed: 0–360° reciprocating swing; Pressure: 5–100 N |
| Dispensing System | 4 Groups × 1.8 L each; Flow Rate: 0–50 ml/min; Mechanical Stirring: 2 Groups; Liquid Level Alert: Yes |
| Disc Storage | 20 Grinding/Polishing Discs; Disc Life Alert: Usage count or force-based |
| Cleaning Station | Water Rinse + Ultrasonic + High-Speed Spin-Dry + Independent Air Blow-Dry |
| Control System | PLC + 15-inch Main Screen + 7-inch Auxiliary Screen; Dual 24-inch Computer Displays |
| Safety Features | Emergency Stop, Safety Door Lock (PLd level), Three-Color Alarm Light |
| Program Library | 30 Program Groups; Max 10 Steps per Program; End Conditions: Remaining/Grind Amount (min 0.001 mm) or Time |
| Grinding Modes | By Pressure (0–100 N) or Speed (min 0.001 mm/s) |
| Sample Output | Face-up, orderly arranged in recovery tray to prevent surface scratching |
| Dimensions (Screen & Light Folded) | 2400 × 1320 × 2000 mm |
| Weight | 1500 kg |
| Parameter | Specification |
|---|---|
| Technique | Focused Ion Beam (FIB) |
| Ion Source | Gallium (Ga⁺) ion beam |
| Milling Resolution | Nanometer-scale precision |
| Operating Modes | Milling, polishing, deposition |
| Imaging Support | SEM-assisted navigation |
| Deposition | Protective layers (Pt / C) |
| Sample Geometry | Bulk, thin films, devices |
| Site Specificity | Yes (ROI-targeted) |
| Sample Preparation | TEM lamella, APT needle, cross-section |
| Information Enabled | Access to buried interfaces and defects |
| Typical Use Cases | Semiconductor devices, multilayers, interfaces |
