Epoxy Resin GHEXA-MNT-CON-EPO-007
| Parameter | Value |
|---|---|
| Product Name | Epoxy Resin (10:1 Fast-Cure System) |
| Model | GHEXA-MNT-CON-EPO-007 |
| Type | Two-component epoxy (Resin A + Hardener B) |
| Mixing Ratio | 10:1 by volume (Resin : Hardener) |
| Curing Conditions | 5 minutes at 150°C |
| Curing Characteristic | Bubble-free cure; turns red upon full cure |
| Appearance (Uncured) | Clear to pale yellow liquid (Resin); clear liquid (Hardener) |
| Appearance (Cured) | Red solid |
| Chemical Resistance | Excellent – resists most chemical etchants after curing |
| Adhesion | Superior to metals, ceramics, glass, most plastics |
| Application Method | Brush, pipette, or dispensing needle |
| Primary Uses | Delicate specimen bonding, TEM stacking, pre-coating, PCB micro-hole filling |
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Description
GHEXA-MNT-CON-EPO-007 is a high-performance, fast-curing two-component epoxy resin system (10:1 resin-to-hardener ratio) specially formulated for precision mounting and bonding in advanced materials characterization. Ideal for delicate or small-scale specimens, it delivers bubble-free curing in just 5 minutes at 150°C, excellent chemical resistance post-cure, and a distinctive red color change upon full polymerization — making it the go-to choice for TEM sample preparation, IC device mounting, PCB micro-hole filling, and pre-coating applications in electronics, semiconductor, and materials research labs.
Specifications
| Parameter | Value |
|---|---|
| Product Name | Epoxy Resin (10:1 Fast-Cure System) |
| Model | GHEXA-MNT-CON-EPO-007 |
| Type | Two-component epoxy (Resin A + Hardener B) |
| Mixing Ratio | 10:1 by volume (Resin : Hardener) |
| Curing Conditions | 5 minutes at 150°C |
| Curing Characteristic | Bubble-free cure; turns red upon full cure |
| Appearance (Uncured) | Clear to pale yellow liquid (Resin); clear liquid (Hardener) |
| Appearance (Cured) | Red solid |
| Chemical Resistance | Excellent – resists most chemical etchants after curing |
| Adhesion | Superior to metals, ceramics, glass, most plastics |
| Application Method | Brush, pipette, or dispensing needle |
| Primary Uses | Delicate specimen bonding, TEM stacking, pre-coating, PCB micro-hole filling |
Key Applications & Uses
- Bonding cover glass to small or fragile specimens such as integrated circuits (ICs), microelectronic devices, MEMS, and thin sections for protection during grinding, polishing, or ion milling.
- TEM (Transmission Electron Microscopy) sample preparation — adhering multiple thin specimens in stacks for cross-sectional analysis with minimal artifacts.
- Pre-coating delicate samples prior to full encapsulation in hot mounting or cold mounting resins to enhance edge retention and prevent damage.
- Filling micro-holes and vias in printed circuit boards (PCBs) for cross-sectioning and failure analysis in electronics and semiconductor quality labs.
- Precision bonding and mounting of ceramics, glass, metals, composites, and polymers in university research, R&D, failure analysis, and quality control laboratories across pharma, biotech, electronics, and materials science sectors.
Why Choose from G-Hexa?
- Ultra-fast, bubble-free curing — Achieves full cure in only 5 minutes at 150°C with no trapped air bubbles, significantly reducing preparation time for time-sensitive projects.
- Distinct visual cure indicator — Turns bright red upon complete polymerization, providing clear confirmation of cure status and eliminating guesswork.
- Exceptional chemical & mechanical stability — Cured epoxy withstands aggressive etchants and provides strong, durable adhesion across a wide range of substrates.
- Tailored for precision work — Low-viscosity formulation allows easy application with brush or pipette, perfect for micro-scale and delicate specimens where standard mounting compounds are unsuitable.
- Flexible packaging & availability — Offered in small (10g resin + 1g hardener) and larger (100g resin + 10g hardener) kits to suit low-volume research or higher-throughput labs, with reliable stock and fast delivery from G-Hexa.
- Trusted quality & support — Backed by G-Hexa’s expertise in metallographic and electron microscopy consumables, including application guidance for optimal results with your specific samples and equipment.
Frequently Asked Questions (FAQs)
Q: What is the exact mixing ratio and curing time for GHEXA-MNT-CON-EPO-007? A: Mix Resin (Part A) and Hardener (Part B) at a 10:1 volume ratio. Cure for 5 minutes at 150°C to achieve a bubble-free, fully polymerized red solid.
Q: How do I know when the epoxy has fully cured? A: The material changes from clear/pale to a distinct red color upon complete curing, serving as a reliable visual indicator.
Q: Is this epoxy suitable for TEM lamella preparation or FIB work? A: Yes — it is widely used for bonding cover slips to delicate TEM specimens, stacking multiple sections, and pre-coating prior to focused ion beam (FIB) milling or encapsulation.
Q: Can it be used on non-metallic samples like polymers or ceramics? A: Absolutely. GHEXA-MNT-CON-EPO-007 provides excellent adhesion to metals, ceramics, glass, most plastics, and composites.
Q: What package sizes are available? A: Small kit: 10g Resin + 1g Hardener; Larger kit: 100g Resin + 10g Hardener — perfect for both occasional use in research labs and higher-volume industrial applications.
Q: Will this epoxy resist chemical etchants used in metallographic or semiconductor preparation? A: Yes — once fully cured, it exhibits strong resistance to most common chemical etchants, making it ideal for subsequent preparation steps.
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