Non-Crystallizing Silica GHX-CON-POL-SIL-002

Parameter Details
Product Name Non-Crystallizing Silica GHX-CON-POL-SIL-002
Brand G-Hexa
Form Liquid Suspension
Material Colloidal Silica (SiOβ‚‚)
Particle Size 50 nm
pH Level 10.2 (Alkaline)
Function Chemical-Mechanical Polishing (CMP)
Crystallization Non-Crystallizing Formulation
Packaging Options 500 ml, 1000 ml, 1.9 L
Order Numbers 06.07.310 (500 ml), 06.07.320 (1000 ml), 06.07.322 (1.9 L)
Application Compatibility Non-Ferrous Metals, Aluminium, PCBs, ICs, Electronics
Finish Quality Ultra-Fine, Mirror Finish (Final Polishing Stage)
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Description

G-Hexa Non-Crystallizing Silica GHX-CON-POL-SIL-002 is a high-performance final polishing suspension designed for precision surface finishing across a wide range of materials. With a stable non-crystallizing colloidal silica formulation and controlled pH of 10.2, it delivers efficient chemical-mechanical polishing (CMP) action. It is ideal for achieving ultra-smooth, defect-free surfaces on non-ferrous metals, aluminium, PCBs, and integrated circuits, making it highly suitable for advanced laboratory and industrial applications.

Specifications

Parameter Details
Product Name Non-Crystallizing Silica GHX-CON-POL-SIL-002
Brand G-Hexa
Form Liquid Suspension
Material Colloidal Silica (SiOβ‚‚)
Particle Size 50 nm
pH Level 10.2 (Alkaline)
Function Chemical-Mechanical Polishing (CMP)
Crystallization Non-Crystallizing Formulation
Packaging Options 500 ml, 1000 ml, 1.9 L
Order Numbers 06.07.310 (500 ml), 06.07.320 (1000 ml), 06.07.322 (1.9 L)
Application Compatibility Non-Ferrous Metals, Aluminium, PCBs, ICs, Electronics
Finish Quality Ultra-Fine, Mirror Finish (Final Polishing Stage)

Key Applications & Uses

G-Hexa Non-Crystallizing Silica GHX-CON-POL-SIL-002 is optimized for final-stage polishing in precision workflows:

  • Final polishing of non-ferrous metals for ultra-smooth surfaces
  • Surface finishing of aluminium components in engineering and research applications
  • Polishing of printed circuit boards (PCBs) and integrated circuits (ICs)
  • Chemical-mechanical polishing (CMP) for electronic and microelectronic materials
  • Removal of fine scratches after diamond polishing stages
  • Preparation of high-quality surfaces for microscopy and analytical testing

Why Choose from G-Hexa?

G-Hexa provides advanced polishing solutions designed for precision, stability, and versatility:

  • Non-crystallizing formulation ensures long-term stability and consistent performance
  • Optimized pH of 10.2 enhances controlled chemical-mechanical polishing action
  • Ultra-fine 50 nm particles deliver high-quality mirror finishes
  • Suitable for a wide variety of materials, including electronics and soft metals
  • Reliable dispersion ensures uniform polishing results across applications
  • Ideal for final-stage polishing in research, semiconductor, and industrial environments

Frequently Asked Questions (FAQs)

Q1. What is the difference between GHX-CON-POL-SIL-001 and GHX-CON-POL-SIL-002?
GHX-CON-POL-SIL-002 is optimized for a wider range of materials including aluminium, PCBs, and ICs, with a slightly lower pH of 10.2 for broader compatibility.

Q2. What is this product mainly used for?
It is used for final polishing to achieve ultra-smooth, defect-free surfaces in precision applications.

Q3. Can it be used for electronics and semiconductor components?
Yes, it is specifically suitable for PCBs, ICs, and other electronic materials.

Q4. What does non-crystallizing mean?
It means the silica remains stable in suspension without forming crystals, ensuring consistent polishing performance.

Q5. Is this a chemical or mechanical polishing product?
It provides chemical-mechanical polishing (CMP), combining both chemical action and fine abrasive finishing.

Q6. How should the product be stored?
Store in a cool, dry place in a tightly sealed container. Shake gently before use to ensure uniform dispersion.

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