Acrylic Resin GHEXA-MNT-CON-ACR-008

Parameter Specification
Product Model GHEXA-MNT-CON-ACR-008
Material Type Acrylic Resin Mounting Compound
System Two-Part (Resin + Hardener)
Part A Resin, Powder (White)
Part B Hardener, Liquid
Mixing Ratio (A:B, w/w) 10 : 8
Mixing Time 2–4 minutes
Curing Time @ 25 °C 8–10 minutes
Peak Exothermic Temperature 80 °C
Hardness Shore D 80
Transparency High
Flowability Excellent
Permeability Excellent
Edge Protection Good
Typical Use Rapid embedding & mounting
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Description

GHEXA-MNT-CON-ACR-008 Acrylic Resin Mounting Compound is a high-clarity, fast-curing acrylic embedding resin engineered for rapid sample mounting, encapsulation, and protection in laboratory and industrial environments. Designed for metallography, PCB preparation, and electronic component protection, this two-part resin system delivers excellent permeability, smooth flow, and strong edge retention—enabling bubble-free embedding and consistent, high-quality finishes. With a curing time of just 8–10 minutes at 25 °C, it is ideal for high-throughput labs requiring fast turnaround and reliable results.


Specifications

Parameter Specification
Product Model GHEXA-MNT-CON-ACR-008
Material Type Acrylic Resin Mounting Compound
System Two-Part (Resin + Hardener)
Part A Resin, Powder (White)
Part B Hardener, Liquid
Mixing Ratio (A:B, w/w) 10 : 8
Mixing Time 2–4 minutes
Curing Time @ 25 °C 8–10 minutes
Peak Exothermic Temperature 80 °C
Hardness Shore D 80
Transparency High
Flowability Excellent
Permeability Excellent
Edge Protection Good
Typical Use Rapid embedding & mounting

Ordering Information

Order No. Description Package
02.03.411 Resin (White Powder) 1 kg
02.03.412 Hardener (Liquid) 800 ml
02.03.421 Resin (White Powder) 2.5 kg
02.03.423 Hardener (Liquid) 2000 ml

Key Applications & Uses

  • Metallographic sample mounting and preparation

  • PCB cross-sectioning and failure analysis

  • Semiconductor and electronic component encapsulation

  • Rapid laboratory sample embedding

  • Edge retention for grinding and polishing processes

  • Research, quality control, and materials testing workflows

  • High-volume industrial and production labs requiring fast curing


Why Choose from G-Hexa?

  • Laboratory-Grade Quality – Carefully selected materials for consistent curing and reproducible results

  • Fast Turnaround Performance – Short curing time improves workflow efficiency and throughput

  • Reliable Supply Chain – Ready stock for universities, pharma, biotech, and industrial labs

  • Technical Support – Application guidance and product selection assistance from specialists

  • Competitive Pricing – Cost-effective bulk packaging options

  • Trusted Scientific Partner – G-Hexa supplies dependable analytical and preparation solutions for professional laboratories worldwide


Frequently Asked Questions (FAQs)

Q1: How long does the resin take to cure?
At 25 °C, the compound cures fully within 8–10 minutes, enabling rapid processing and high throughput.

Q2: What mixing ratio should be used?
Mix Part A (resin powder) and Part B (hardener liquid) at a weight ratio of 10:8. Mix thoroughly for 2–4 minutes.

Q3: Is this resin suitable for delicate electronic components or PCBs?
Yes. Its high permeability and flowability allow the resin to penetrate fine gaps, making it ideal for PCB and electronics encapsulation.

Q4: Does it provide good edge retention during grinding and polishing?
Yes. The Shore D hardness of 80 and good edge protection help maintain sharp sample boundaries.

Q5: Can it be used for high-volume laboratories?
Absolutely. The fast curing time and easy mixing make it well-suited for batch processing and large sample volumes.

Q6: Are different packaging sizes available?
Yes. Multiple resin and hardener pack sizes are available to match small research labs and large industrial requirements.

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